BE Semiconductor Industries NV (BESIa)

138.00 -1.90 (-1.36%)
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BE Semiconductor Industries NV Company Profile

Equity Type
BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company’s principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
Contact Information
Duiven,6921 RW Netherlands
31 26 319 4500
Top Executives
Nicolaas Willem Hoek 65 2018 Independent Member of Supervisory Board
Mona ElNaggar 54 2012 Independent Member of Supervisory Board
Carlo Bozotti 69 2018 Independent Member of Supervisory Board
Elke Eckstein 59 2021 Independent Member of Supervisory Board
Laura A. Oliphant 60 2021 Independent Member of Supervisory Board
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