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BE Semiconductor Industries NV (BSI1)

Frankfurt
Currency in EUR
Disclaimer
159.250
+1.000(+0.63%)
Closed
BSI1 Scorecard
Fair Value
Day's Range
159.250159.250
52 wk Range
85.420180.150
Bid/Ask
152.10 / 155.15
Prev. Close
158.25
Open
159.25
Day's Range
159.25-159.25
52 wk Range
85.42-180.15
Volume
1
Average Volume (3m)
114
1-Year Change
59.01%
Shares Outstanding
77,015,794
Fair Value
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Dividends Payment Streak
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Analysts
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BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company’s principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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